METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed wiring board which inexpensively manufactures the multilayer printed wiring board having less plate thickness deviation and curvature than before without impairing operation efficiency. SOLUTION: The method of manufacturing the multilayer printed wiring board includes: interposing at least more than three prepregs 3 between a plurality of inner layer materials 2 formed by providing circuits 1 on surfaces; laminating metal foils 4 on surfaces of outermost inner layer materials 2 with prepregs 3 interposed to obtain a laminate 5; and subjecting the laminate 5 to heat-press molding. In the method, as a noncontact type prepregs 3a which do not come in contact with the inner layer materials 2, prepregs are used which have a curing time 20 to 40 seconds shorter than the curing time of the contact type prepregs 3b coming in contact with the inner layer materials 2. COPYRIGHT: (C)2010,JPO&INPIT