THERMALLY CONDUCTIVE RESIN SHEET, HEAT CONDUCTION PLATE, THERMALLY CONDUCTIVE PRINTED WIRING BOARD AND RADIATING MEMBER

PROBLEM TO BE SOLVED: To provide a thermally conductive resin sheet excellent in thermal conductivity as well as sufficient adhesion strength with a copper foil without decreasing formability, and to provide a heat conduction plate, a thermally conductive printed wiring board, and a radiating member...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAMI HIROAKI, FUKUKAWA HIROSHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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