THERMALLY CONDUCTIVE RESIN SHEET, HEAT CONDUCTION PLATE, THERMALLY CONDUCTIVE PRINTED WIRING BOARD AND RADIATING MEMBER

PROBLEM TO BE SOLVED: To provide a thermally conductive resin sheet excellent in thermal conductivity as well as sufficient adhesion strength with a copper foil without decreasing formability, and to provide a heat conduction plate, a thermally conductive printed wiring board, and a radiating member...

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Bibliographische Detailangaben
Hauptverfasser: NAKAMI HIROAKI, FUKUKAWA HIROSHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a thermally conductive resin sheet excellent in thermal conductivity as well as sufficient adhesion strength with a copper foil without decreasing formability, and to provide a heat conduction plate, a thermally conductive printed wiring board, and a radiating member. SOLUTION: The thermally conductive resin sheet consists of a prepreg obtained by impregnating a carbon fiber nonwoven fabric made of carbon fibers 2 having an average fiber diameter of 0.5 to 10 μm and a fiber length of not more than 25 mm and bonded with a binder resin, with a thermosetting resin 3 containing an inorganic filler 4, wherein the sheet 1 contains a filler, as the inorganic filler, having a thermal conductivity of not less than 20 W/m×K. There are also disclosed a heat conduction plate, a thermally conductive printed wiring board, and a radiating member using the sheet. COPYRIGHT: (C)2010,JPO&INPIT