RESIN COMPOSITION FOR ENCAPSULATION AND RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a resin composition for encapsulation that has excellent workability because of high flowability, has excellent dependability of encapsulation because warpage is controlled in an encapsulation product, and protects a hollow structure of the encapsulation product. SOL...

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Bibliographische Detailangaben
Hauptverfasser:	WADA YUZURU, MASUDA HIROSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin composition for encapsulation that has excellent workability because of high flowability, has excellent dependability of encapsulation because warpage is controlled in an encapsulation product, and protects a hollow structure of the encapsulation product. SOLUTION: This resin composition for encapsulation includes (A) an epoxy resin represented by general formula (1), (B) a specific aromatic amine curing agent, and (C) a silica powder as essential ingredients, wherein a flexural modulus at 180°C is ≥4.0 GPa. COPYRIGHT: (C)2010,JPO&INPIT