CUTTER

CUTTER

PROBLEM TO BE SOLVED: To provide a cutter capable of high-speed cutting by thinning a cutting blade by strengthening a bond for forming a tip and reducing cutting resistance in a cutter containing abrasive grains such as diamond. SOLUTION: In the cutter, the high-speed cutting can be achieved by uni...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KOBAYASHI MOKICHI, SATO ITSUO, ICHIJO TOSHIHIRO, OTSU SHINKI
Format: Patent
Sprache:eng
Schlagworte:
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
GRINDING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
POLISHING
SOLDERING OR UNSOLDERING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a cutter capable of high-speed cutting by thinning a cutting blade by strengthening a bond for forming a tip and reducing cutting resistance in a cutter containing abrasive grains such as diamond. SOLUTION: In the cutter, the high-speed cutting can be achieved by uniformly increasing a forming density of a portion joining the bond and a substrate, a plate part extending in the radial direction is interposed in the inner part of an abrasive grain layer, and through-holes are formed for joining the bonds facing each other with the plate part therebetween. The wall part forming the through-holes is incliningly provided with respect to the vertical direction to the radial direction of the substrate. COPYRIGHT: (C)2010,JPO&INPIT