SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device in which a plated film is formed on bonding pads on a surface of an interconnection substrate on which semiconductor chips are mounted. SOLUTION: A package substrate 1 on which semiconductor chips 2A, 2B, 2C are mounted includes side faces formed by cutting with a dicing blade. Interconnections 5 connected to the bonding pads 9, for electrolytic plating on surfaces of the bonding pads 9, are formed on the package substrate 1. The interconnections 5 for electrolytic plating extend toward the side faces of the package substrate 1, and the ends of the interconnections are arranged inner from the side faces. COPYRIGHT: (C)2010,JPO&INPIT