METHOD FOR ANALYSIS OF SOLDER COMPOSITION

PROBLEM TO BE SOLVED: To provide a method for simultaneously analyzing all alloy constituent elements and impurity elements contained in a lead-free solder. SOLUTION: The method includes: the liquefaction process S1 comprising the process for weighing a sample, a process for mixing acids, and the pr...

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Hauptverfasser: HAYASHI HIDEO, UEMOTO MICHIHISA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for simultaneously analyzing all alloy constituent elements and impurity elements contained in a lead-free solder. SOLUTION: The method includes: the liquefaction process S1 comprising the process for weighing a sample, a process for mixing acids, and the process for adding a mixed acid to the sample and solving it; and the measurement process S2 for measuring a sample solution prepared in the liquefaction process, and quantitatively analyzing the elements in the sample. The mixed acid has a mixed sulfuric acid and nitric acid and is used as the acid for solving the sample. The mixed acid is prepared by diluting the acids using water. In the mixed acid, the concentration of the sulfuric acid is 3.6 mol/L or more and 13.4 mol/L or less. The concentration of the nitric acid is 1.3 mol/L or more and 3.4 mol/L or less. The molar ratio of the sulfuric acid and the nitric acid is 2.6:1 or more and 7.9:1 or less. The lead-free solder is completely dissolved without causing residues to be generated. All alloy constituent elements and the impurity elements contained in the lead-free solder can be analyzed simultaneously and accurately. COPYRIGHT: (C)2010,JPO&INPIT