HIGHLY THERMOCONDUCTIVE HIGH GLASS TRANSITION TEMPERATURE (TG) RESIN COMPOSITION APPLICABLE TO PRINTED BOARD, AND PREPREG AND COATING USING THE SAME

PROBLEM TO BE SOLVED: To provide a highly thermoconductive high glass transition temperature (Tg) resin composition suitable for forming a dielectric layer having insulating properties and heat dissipation properties on a PCB (printed circuit board ), and a PCB having high thermal conductivity. SOLU...

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Bibliographische Detailangaben
Hauptverfasser:	FENG DIANRUN, XIE SONGYUE, CHEN HAO-SHENG, LIAO TEAO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a highly thermoconductive high glass transition temperature (Tg) resin composition suitable for forming a dielectric layer having insulating properties and heat dissipation properties on a PCB (printed circuit board ), and a PCB having high thermal conductivity. SOLUTION: The resin composition includes 20-70 wt.% of a brominated epoxy resin, 1-10 wt.% of a curing agent, 0.1-10 wt.% of a curing accelerator, 0-20 wt.% of inorganic powder, 5-85 wt.% of highly thermoconductive powder, and 0-10 wt.% of a processing aid. COPYRIGHT: (C)2010,JPO&INPIT