WORKING METHOD

PROBLEM TO BE SOLVED: To enable heading of columnar polycrystalline silicons embedded in a mono-crystal silicon with ease and high accuracy. SOLUTION: In the working method, after a step (b) of grinding a portion of a mono-crystal silicon 11 with a grinding tool 20, the mono-crystal silicon 11 and c...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	MIYAI TOSHITERU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	MIYAI TOSHITERU
description	PROBLEM TO BE SOLVED: To enable heading of columnar polycrystalline silicons embedded in a mono-crystal silicon with ease and high accuracy. SOLUTION: In the working method, after a step (b) of grinding a portion of a mono-crystal silicon 11 with a grinding tool 20, the mono-crystal silicon 11 and columnar polycrystalline silicons 12 are polished simultaneously in a drying way by using a polishing tool 30, so that uniform steping be performed even when different-hardness materials are included by a step (c) for withdrawing the heads of the columnar polycrystalline silicons 12. COPYRIGHT: (C)2010,JPO&INPIT
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2010045310A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2010045310A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2010045310A3</originalsourceid><addsrcrecordid>eNrjZOAL9w_y9vRzV_B1DfHwd-FhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhgYGJqbGhgaOxkQpAgACdR1L</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>WORKING METHOD</title><source>esp@cenet</source><creator>MIYAI TOSHITERU</creator><creatorcontrib>MIYAI TOSHITERU</creatorcontrib><description>PROBLEM TO BE SOLVED: To enable heading of columnar polycrystalline silicons embedded in a mono-crystal silicon with ease and high accuracy. SOLUTION: In the working method, after a step (b) of grinding a portion of a mono-crystal silicon 11 with a grinding tool 20, the mono-crystal silicon 11 and columnar polycrystalline silicons 12 are polished simultaneously in a drying way by using a polishing tool 30, so that uniform steping be performed even when different-hardness materials are included by a step (c) for withdrawing the heads of the columnar polycrystalline silicons 12. COPYRIGHT: (C)2010,JPO&INPIT</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100225&DB=EPODOC&CC=JP&NR=2010045310A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100225&DB=EPODOC&CC=JP&NR=2010045310A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIYAI TOSHITERU</creatorcontrib><title>WORKING METHOD</title><description>PROBLEM TO BE SOLVED: To enable heading of columnar polycrystalline silicons embedded in a mono-crystal silicon with ease and high accuracy. SOLUTION: In the working method, after a step (b) of grinding a portion of a mono-crystal silicon 11 with a grinding tool 20, the mono-crystal silicon 11 and columnar polycrystalline silicons 12 are polished simultaneously in a drying way by using a polishing tool 30, so that uniform steping be performed even when different-hardness materials are included by a step (c) for withdrawing the heads of the columnar polycrystalline silicons 12. COPYRIGHT: (C)2010,JPO&INPIT</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAL9w_y9vRzV_B1DfHwd-FhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhgYGJqbGhgaOxkQpAgACdR1L</recordid><startdate>20100225</startdate><enddate>20100225</enddate><creator>MIYAI TOSHITERU</creator><scope>EVB</scope></search><sort><creationdate>20100225</creationdate><title>WORKING METHOD</title><author>MIYAI TOSHITERU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2010045310A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>MIYAI TOSHITERU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIYAI TOSHITERU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WORKING METHOD</title><date>2010-02-25</date><risdate>2010</risdate><abstract>PROBLEM TO BE SOLVED: To enable heading of columnar polycrystalline silicons embedded in a mono-crystal silicon with ease and high accuracy. SOLUTION: In the working method, after a step (b) of grinding a portion of a mono-crystal silicon 11 with a grinding tool 20, the mono-crystal silicon 11 and columnar polycrystalline silicons 12 are polished simultaneously in a drying way by using a polishing tool 30, so that uniform steping be performed even when different-hardness materials are included by a step (c) for withdrawing the heads of the columnar polycrystalline silicons 12. COPYRIGHT: (C)2010,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_epo_espacenet_JP2010045310A
source	esp@cenet
subjects	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
title	WORKING METHOD
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-13T01%3A34%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MIYAI%20TOSHITERU&rft.date=2010-02-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2010045310A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true