WORKING METHOD

WORKING METHOD

PROBLEM TO BE SOLVED: To enable heading of columnar polycrystalline silicons embedded in a mono-crystal silicon with ease and high accuracy. SOLUTION: In the working method, after a step (b) of grinding a portion of a mono-crystal silicon 11 with a grinding tool 20, the mono-crystal silicon 11 and c...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: MIYAI TOSHITERU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To enable heading of columnar polycrystalline silicons embedded in a mono-crystal silicon with ease and high accuracy. SOLUTION: In the working method, after a step (b) of grinding a portion of a mono-crystal silicon 11 with a grinding tool 20, the mono-crystal silicon 11 and columnar polycrystalline silicons 12 are polished simultaneously in a drying way by using a polishing tool 30, so that uniform steping be performed even when different-hardness materials are included by a step (c) for withdrawing the heads of the columnar polycrystalline silicons 12. COPYRIGHT: (C)2010,JPO&INPIT