COATING AND DEVELOPING METHOD, AND COATING AND DEVELOPING DEVICE

PROBLEM TO BE SOLVED: To provide a coating and developing method, and a coating and developing device for suppressing defective development caused by deposition of residue to a resist surface when a resist is applied and the development is performed after exposure to form a resist pattern. SOLUTION:...

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Bibliographische Detailangaben
Hauptverfasser:	KYODA HIDEJI, KITANO JUNICHI, MOTOTAKE KOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a coating and developing method, and a coating and developing device for suppressing defective development caused by deposition of residue to a resist surface when a resist is applied and the development is performed after exposure to form a resist pattern. SOLUTION: The coating and developing method comprises: a step of applying a resist liquid to the surface of a wafer W to form a resist film; a step of exposing the surface of the wafer W on which the resist film is formed; and a step of supplying acidic alcohol L onto the surface of the exposed wafer W to dissolve a part of low molecular layer of the resist film formed on the surface of the wafer and, further, to enhance solubility of the low molecular layer for developing liquid used for development which is performed on and after. COPYRIGHT: (C)2010,JPO&INPIT