PLATING APPARATUS

PROBLEM TO BE SOLVED: To provide a plating apparatus which can reduce the distribution of the thickness of a plated film that is formed on an article to be plated, without lowering the production efficiency. SOLUTION: The plating apparatus comprises: a plating tank; an annular barrel container 20; a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YANO KENZO, SHINDO HIROSHI, AIBA TAKASHI, SAKURAI TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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