PLATING APPARATUS

PLATING APPARATUS

PROBLEM TO BE SOLVED: To provide a plating apparatus which can reduce the distribution of the thickness of a plated film that is formed on an article to be plated, without lowering the production efficiency. SOLUTION: The plating apparatus comprises: a plating tank; an annular barrel container 20; a...

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Bibliographische Detailangaben
Hauptverfasser: YANO KENZO, SHINDO HIROSHI, AIBA TAKASHI, SAKURAI TAKASHI
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a plating apparatus which can reduce the distribution of the thickness of a plated film that is formed on an article to be plated, without lowering the production efficiency. SOLUTION: The plating apparatus comprises: a plating tank; an annular barrel container 20; an anode; a rotating means for rotating the barrel container 20 around the center of a hollow part of the barrel container 20; and a vibration-generating means for vibrating the barrel container 20. The space in the barrel container 20 which accommodates the article to be plated therein is partitioned by a partitioning plate 22. A cathode is provided at the bottom face of the barrel container 20. COPYRIGHT: (C)2010,JPO&INPIT