AQUEOUS ADHESIVE DISPERSION

PROBLEM TO BE SOLVED: To provide an aqueous adhesive composition which achieves a high initial strength, especially in a wet state (wet strength) after application to substrates to be joined and subsequent joining. SOLUTION: There is provided an aqueous polymer dispersion containing the following co...

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Bibliographische Detailangaben
Hauptverfasser:	PANTKE DIETRICH, MUSCH RUEDIGER, PANSKUS KNUT
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES GENERAL PROCESSES OF COMPOUNDING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an aqueous adhesive composition which achieves a high initial strength, especially in a wet state (wet strength) after application to substrates to be joined and subsequent joining. SOLUTION: There is provided an aqueous polymer dispersion containing the following components (a) and (b): (a) a polychloroprene dispersion having an average particle diameter of 60-220 nm; and (b) an aqueous silicon dioxide dispersion containing SiO2particles having a particle diameter of 1-400 nm. COPYRIGHT: (C)2010,JPO&INPIT