METHOD AND DEVICE FOR FLATTENING BASE MATERIAL INCLUDING RESIN MATERIAL

PROBLEM TO BE SOLVED: To provide a method and a device for flattening a resin material wafer (a base material including a resin material) effectively carrying out flattening work. SOLUTION: A resin material in a region at a certain depth from a surface on a resin material part 75 side of a resin mat...

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Bibliographische Detailangaben
Hauptverfasser:	KOGURE NAOAKI, TSUJIMURA MANABU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method and a device for flattening a resin material wafer (a base material including a resin material) effectively carrying out flattening work. SOLUTION: A resin material in a region at a certain depth from a surface on a resin material part 75 side of a resin material wafer W having the resin material part 75 toward the inside is changed/modified, by bringing a medical agent mixed in grinding slurry 70 into contact therewith, to be formed into a modified layer 80. The modified layer 80 is mechanically removed and processed by a grinding member 30 and the grinding slurry 70 at the same time, and thereby the surface of the resin material wafer W is flattened. COPYRIGHT: (C)2010,JPO&INPIT