DEFECT INSPECTION DEVICE, DEFECT INSPECTION SYSTEM, AND DEFECT INSPECTION METHOD

PROBLEM TO BE SOLVED: To provide a defect inspection device, a defect inspection system and a defect inspection method that use defect data for analysis without lowering the number of samples of a defect with a high killer rate. SOLUTION: Defect data on a defect on a semiconductor wafer 111 is acquired by an inspection unit 110 of the defect inspection device 100 and stored in a storage unit 122, and the obtained defect data are classified into a defect kind by a classification determination unit 123 on the basis of a predetermined classification standard previously stored in the storage unit 122. A processing arithmetic operation unit 124 generates a first data list of objects to be reviewed for detailed observation for the classified defect data and a second data list obtained by adding defect data which are not included in the objects to be reviewed, but need to be analyzed to the first data list, and the fist and second data lists are put together with a data list acquired in another inspection stage to specify the cause of occurrence of a defect which is not included in the objects to be re viewed, but needs to be analyzed and the occurrence process thereof. COPYRIGHT: (C)2010,JPO&INPIT