SEMICONDUCTOR LIGHT-EMITTING ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND LAMP

PROBLEM TO BE SOLVED: To provide: a semiconductor light-emitting element which has electrodes having superior bondability and corrosion resistance; a method of manufacturing the same; and a lamp. SOLUTION: The semiconductor light-emitting element 1 includes a substrate 101, a laminated semiconductor...

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Hauptverfasser: HIRAIWA DAISUKE, OKABE TAKEHIKO, WATANABE MUNETAKA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide: a semiconductor light-emitting element which has electrodes having superior bondability and corrosion resistance; a method of manufacturing the same; and a lamp. SOLUTION: The semiconductor light-emitting element 1 includes a substrate 101, a laminated semiconductor layer 20, one electrode 111 formed on the upper surface 106c of the laminated semiconductor layer 20, and the other electrode 108 formed on a semiconductor layer exposed surface 104c formed by cutting a portion of the laminated semiconductor layer 20, wherein at least one of the one electrode 111 and the other electrode 108 has a translucent electrode 109 having a bonding recess on an upper surface 109c, a bonding layer 110 formed so as to cover the bonding recess, and a bonding pad electrode 120 formed so as to cover the bonding layer 110 and having an inclined surface 119c, gradually decreasing in film thickness to the outside, formed at an outer peripheral portion 120d. COPYRIGHT: (C)2010,JPO&INPIT