LAMINATED LEAD FRAME AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a laminated lead frame that meets diffusion bonding conditions of a laminated lead frame having no plating layer formed. SOLUTION: The laminated lead frame is constituted by applying predetermined form-shaping to each of a lead frame material and a lead frame materia...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATSUNAGA KIYOSHI, KUBO KIMIHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!