LAMINATED LEAD FRAME AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a laminated lead frame that meets diffusion bonding conditions of a laminated lead frame having no plating layer formed. SOLUTION: The laminated lead frame is constituted by applying predetermined form-shaping to each of a lead frame material and a lead frame material for lamination (a conductor plate 16 and a surface outside terminal 17), and bonding the lead frame material for lamination on the form-shaped lead frame material, wherein a surface of the lead frame material made of copper or copper alloy is coated with an copper oxide layer C of ≥0.1 μm in thickness. The copper oxide layer formed on the lead frame material prevents a brittle copper oxide coating film from being formed, and tight adhesiveness between the lead frame material and the formed copper oxide layer improves reliability of a semiconductor device. COPYRIGHT: (C)2010,JPO&INPIT