PRODUCTION METHOD OF ELECTRONIC CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a production method of an electronic circuit board, which produces a high quality electronic circuit board efficiently by mounting a bare IC chip on a base. SOLUTION: In a position of a base 21 for inlet where a bare IC chip 23 is mounted, first adhesive 41 is applied, by such an amount as it does not reach the bump 25 of the bare IC chip 23, by means of a first dispenser 31. The bare IC chip 23 formed by dicing a semiconductor wafer 16 individually is then mounted on the first adhesive 41 which is applied to the base 21 for inlet by means of a pickup nozzle 15 which applies ultrasonic waves to the bare IC chip 23. The bump 25 of the bare IC chip 23 and an antenna 22 are then bonded electrically. Second adhesive 42 is applied to the base 21 for inlet and the bare IC chip 23 by means of a second dispenser 32 so that the entire surface and the entire outer circumferential side surface of the bare IC chip 23 are covered. COPYRIGHT: (C)2010,JPO&INPIT