HEAT PUMP DEVICE

PROBLEM TO BE SOLVED: To improve workability when assembling a control substrate. SOLUTION: This heat pump device is provided with: a compressor 2 for compressing a refrigerant; an air heat exchanger 5 for exchanging the heat between a low-temperature and low-pressure refrigerant and air; a casing 7...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHIGA HIROKI, JINBO YUJI, TAMURA KEIICHI, SORIMACHI TOSHIYUKI
Format: Patent
Sprache:eng
Schlagworte:
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Zusammenfassung:PROBLEM TO BE SOLVED: To improve workability when assembling a control substrate. SOLUTION: This heat pump device is provided with: a compressor 2 for compressing a refrigerant; an air heat exchanger 5 for exchanging the heat between a low-temperature and low-pressure refrigerant and air; a casing 7 housing a blowing fan 9 for blowing air to the air heat exchanger 5; an electrical equipment box 20 housing a control substrate 21 and arranged in an upper part inside the casing 7; and the control substrate 21 fixed to the inner surface of an electrical equipment box cover 25 so that a mounted part surface faces downward. The electrical equipment box cover 25 is provided with fitting pieces 30, which regulate movement of the electrical equipment box cover 25 in the back and forth direction and in the right and left direction by fitting on the periphery of an upper end of the electrical equipment box 20 when the electrical equipment box cover 25 is turned and placed on the electrical equipment box 20, in four sides of the periphery of the top surface of the electrical equipment box cover 25. COPYRIGHT: (C)2010,JPO&INPIT