TILE PANEL

PROBLEM TO BE SOLVED: To provide a tile panel improved in construction efficiency, easiness of handling, and post-construction impact resistance by solving problems of conventional joint connection tile panels in which an epoxy resin joint material is used. SOLUTION: In this tile panel in which tile...

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Bibliographische Detailangaben
Hauptverfasser:	KAWAI HIDEJI, AMIMOTO KOJI, KUBOUCHI YUKO, HARA KENICHI, MORIKAWA SEIJI, IMURA TAKEO
Format:	Patent
Sprache:	eng
Schlagworte:	BUILDING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS FIXED CONSTRUCTIONS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a tile panel improved in construction efficiency, easiness of handling, and post-construction impact resistance by solving problems of conventional joint connection tile panels in which an epoxy resin joint material is used. SOLUTION: In this tile panel in which tiles are joined to each other with a resin joint material charged into the joints between the tiles, the Young's modulus of the resin joint material is 0.15-5.0 GPa. The resin joint material for joining the tiles has a hardness specific to the epoxy resin and a proper elasticity (flexibility). COPYRIGHT: (C)2010,JPO&INPIT