LASER BEAM IRRADIATION METHOD AND APPARATUS

PROBLEM TO BE SOLVED: To provide a laser beam irradiation method and apparatus, which can perform uniform machining by eliminating adverse effects of heat when a photolytic reaction is caused on a substrate by laser beam irradiation. SOLUTION: In the laser beam irradiation method, the photolytic rea...

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Bibliographische Detailangaben
Hauptverfasser: KOYANAGI KUNIHIKO, OTSU HIDEHIKO, NAKAMURA TETSUSHIGE, SATO RYOSUKE, EBISAWA TAKASHI, TERAO KATSUHIRO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a laser beam irradiation method and apparatus, which can perform uniform machining by eliminating adverse effects of heat when a photolytic reaction is caused on a substrate by laser beam irradiation. SOLUTION: In the laser beam irradiation method, the photolytic reaction is caused by irradiating a raw film precursor formed on the substrate with a laser beam in producing a thin film on the substrate. The laser beam is radiated while the substrate is rotated in the planar direction and is moved along the planar direction relative to a position to be irradiated with the laser beam. The irradiation apparatus includes a supporting section which supports the substrate on which the raw film is formed, a rotating mechanism which rotates the substrate, a moving mechanism which moves the substrate along the planar direction, a laser beam irradiation means which irradiates the substrate with the laser beam, and a controlling section which causes the photolytic reaction on the raw film by irradiating the substrate with the laser beam by the laser beam irradiation means while the substrate is rotated in the planar direction by the rotating mechanism and is moved relatively along the planar direction by the moving mechanism. COPYRIGHT: (C)2010,JPO&INPIT