CIRCUIT DEVICE

CIRCUIT DEVICE

PROBLEM TO BE SOLVED: To provide a circuit device reduced in power loss due to a conductive pattern. SOLUTION: This hybrid integrated circuit device 10 is structured to include: a circuit board 12 where a hybrid integrated circuit comprising a conductive pattern 26 and a first power element 18 is in...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KUDO KIYOAKI, INAGAKI YUKI, IWABUCHI AKIRA
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a circuit device reduced in power loss due to a conductive pattern. SOLUTION: This hybrid integrated circuit device 10 is structured to include: a circuit board 12 where a hybrid integrated circuit comprising a conductive pattern 26 and a first power element 18 is incorporated in its upper surface; a sealing resin 30 sealing the hybrid integrated circuit by covering the circuit board 12; and leads 14 fixed to pads consisting of the conductive pattern 26 and extending to the outside. A thick conductive plate 16 is arranged in an intermediate part of a path connected to the first power element 18. COPYRIGHT: (C)2010,JPO&INPIT