HEAT DISSIPATION STRUCTURE OF ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an electronic apparatus, which has a simple configuration, can efficiently and reliably radiate heat from a heat generating electronic component to the outside when using the electronic apparatus, and in addition, reliably suppress vibration applied to the electronic component. SOLUTION: The heat dissipation structure includes: heat dissipation members 10, 90; a thermal contacting part 12 provided on the heat dissipation members to thermally contact the electronic component 40 and receive heat generated from the electronic component; a first heat dissipation part 14a disposed on the heat dissipation members to continue to the thermal contacting part in a first direction and radiate heat transmitted from the thermal contacting part; and first pressing parts 16a, 96a disposed on a part of the first heat dissipation part to mechanically contact and press the substrate. COPYRIGHT: (C)2010,JPO&INPIT