SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To improve heat dissipation performance, reliability and reduction in manufacturing cost in a semiconductor device. SOLUTION: In a BGA (ball grid array) 8 in which an SOC (system on chip) 1 is mounted on a wiring board 3, the SOC 1 includes an operation circuit 1g having at least one part of a region on the center portion of the SOC 1, a second pad 1i is provided on the operation circuit 1g of the main surface of the SOC 1, and the second pad 1i is directly connected to a bonding lead 3c of the wiring board 3 by a second wire 4b. With this configuration, the heat generated from the operation circuit 1g is dissipated to the wiring board 3 through the second wire 4b, and the heat dissipation performance of the BGA 8 is improved. COPYRIGHT: (C)2010,JPO&INPIT