AQUEOUS DISPERSING ELEMENT FOR CHEMICAL MECHANICAL POLISHING AND MANUFACTURING METHOD THEREOF, AND CHEMICAL MECHANICAL POLISHING METHOD

PROBLEM TO BE SOLVED: To provide an aqueous dispersing element for chemical mechanical polishing that has high polishing speed and high polishing selectivity to a copper film and reduces surface defects on a surface to be polished, and to provide a chemical mechanical polishing method using the aque...

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Bibliographische Detailangaben
Hauptverfasser:	KUBOUCHI SHO, UCHIKURA KAZUICHI, ANDO MICHIAKI, SHIDA HIROTAKA
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an aqueous dispersing element for chemical mechanical polishing that has high polishing speed and high polishing selectivity to a copper film and reduces surface defects on a surface to be polished, and to provide a chemical mechanical polishing method using the aqueous dispersing element for chemical mechanical polishing. SOLUTION: The aqueous dispersing element for chemical mechanical polishing polishes a copper film containing a silica particle (A) and an amino acid (B), where the silica particle (A) has chemical properties of silanol group density calculated from a specific surface area measured by a BET method and a silanol group amount measured by titration being equal to 1.0-3.0/nm2. COPYRIGHT: (C)2010,JPO&INPIT