DICING LIQUID AND METHOD OF WAFER-DICING

PROBLEM TO BE SOLVED: To provide a dicing liquid that inhibits contaminant residues or particles from being attached to substantially reduce or remove corrosion on an exposed surface when dicing processing of a wafer by sewing. SOLUTION: A dicing liquid includes an acid containing at least one dicarboxylic acid and/or its salt, at least one hydroxycarboxylic acid and/or its salt, or amine group, and a surface acting agent whose base material is phosphate ester-branched alcohol ethoxylate, the surfactant whose base material is alkyl diphenyl oxide disulphonic acid, the surfactant whose base material is dodecylbenzenesulfonic acid (DDBSA), the surfactant whose base material is the second alkyl sulfonic acid, and the surfactant selected from a group composed of the combination thereof. The remaining is substantially de-ionized water, containing no fluorine and pH being about from 1 to 4. COPYRIGHT: (C)2010,JPO&INPIT