DEVICE FOR CONTROLLING PLASMA PROCESSING DEVICE SYSTEM, METHOD OF CONTROLLING PLASMA PROCESSING SYSTEM, AND STORAGE MEDIUM STORING CONTROL PROGRAM

PROBLEM TO BE SOLVED: To simplify a recipe management of a control device for controlling a plasma processing device. SOLUTION: A device controller EC as an example of the method of controlling the plasma processing device system includes: a storage part 250 for storing a reference recipe 300 expres...

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Bibliographische Detailangaben
Hauptverfasser:	MOCHIZUKI HIROO, IIJIMA KIYOHITO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL ELEMENTS OF SUCH SYSTEMS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PHYSICS REGULATING SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To simplify a recipe management of a control device for controlling a plasma processing device. SOLUTION: A device controller EC as an example of the method of controlling the plasma processing device system includes: a storage part 250 for storing a reference recipe 300 expressing a procedure of plasma processing; an operation part 260 for operating a variation value of the state in a plurality of process modules PM at a predetermined timing at processing intervals of at least a plurality of lots; a table generating part 265 for generating adjusting tables 310a, 310b each process module PM for adjusting the reference recipe 300 on the basis of the variation value of the state in the process module PM operated by the operating part 260; and a process performing control part 270 for adjusting the reference recipe 300 with the use of the adjusting tables 310a, 310b for every process module PM generated by the table generating part 265 to plasma-process a wafer by the process module PM in accordance with the adjusted procedure of the reference recipe 300. COPYRIGHT: (C)2010,JPO&INPIT