METHOD FOR BONDING FLEXIBLE PRINTED BOARD

PROBLEM TO BE SOLVED: To solve the following problem: in conventional methods using a connector, solder, an ACF, an NCF or the like for bonding an FPC with a circuit board, cost of parts is high, more man-hours are required for mounting, longer time is required for mounting, temperature for mounting is high, bonding thrust is high, bonding resistance is large, a repairing property is low or the like, as a portable electronic apparatus is made lighter, thinner, shorter and smaller. SOLUTION: Bonding, which provides lower cost, less man-hours, less time, lower temperature, lower load, lower resistance and higher repairing property and is suitable for making lighter, thinner, shorter and smaller, is achieved: by setting a distal end shape to be orthogonal to a vibration direction; by arranging a heating-type ultrasonic horn, which has a cross-sectional shape of a convex blade shape vertical to a pressurized face, so as to be arranged to be vibrated in a direction parallel to a bonding face and parallel to a direction of an electrode; by heating and vibrating, while electrodes of an FPC and a circuit are overlaid and then load is applied vertical to the bonding face at a prescribed pressure, so that the electrodes are metal-bonded with each other; and by joining the FPC with a PCB by using a resin. COPYRIGHT: (C)2010,JPO&INPIT