METHOD OF MANUFACTURING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method of manufacturing substrates, in which the substrates are manufactured by dividing a multiple-set substrate, the multiple-set substrate being divided without using a thrusting-up system using a pin and without making step of manufacturing the substrates compl...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAMURA TOSHIHIRO, IMADA SHINJI, ASAI YASUTOMI, SAGAWA HARUHIDE, TERUI KENICHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing substrates, in which the substrates are manufactured by dividing a multiple-set substrate, the multiple-set substrate being divided without using a thrusting-up system using a pin and without making step of manufacturing the substrates complex. SOLUTION: In a step of forming the multiple-set substrate 10, a conductive member 30 made of a material having conductivity and a larger coefficient of thermal expansion than a material constituting the multiple-set substrate 10 is embedded in a division portion 20 of the multiple-set substrate 10 in a state where electricity can be supplied from outside. In a step of dividing the multiple-set substrate 10, the conductive member 30 is fed with electricity and then caused to thermally expand with heat generated through the electricity feeding, and the division part 20 is caused to crack, thereby dividing the multiple-set substrate 10. COPYRIGHT: (C)2010,JPO&INPIT