FLATNESS MEASUREMENT METHOD AND DEVICE

PROBLEM TO BE SOLVED: To provide a technique easily and precisely measuring the flatness of a plane included in a stage or the like in various kinds of apparatuses. SOLUTION: A surface height position of a plate member 2 is measured in each of the cases when the plate member 2 is mounted at a first...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: SHIBAZAKI HIROSHI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a technique easily and precisely measuring the flatness of a plane included in a stage or the like in various kinds of apparatuses. SOLUTION: A surface height position of a plate member 2 is measured in each of the cases when the plate member 2 is mounted at a first position POS1 of a mounting surface 10 of the stage 1 and when it is mounted at a second position POS2. Next, the thickness component of the plate member 2 is canceled out by obtaining the difference between a measurement result D1 (=A(i)+B(i)) in a measurement point (X1, Yi) and a measurement result D2 (=A(i)+B(i-1)) in a measurement point (X1, Yi-1), and the amount of variation (=B(i)-B(i-1)) of the height of the mounting surface 10 between the measurement points (X1, Yi) and (X1, Yi-1) is calculated. By cumulatively adding the differential operational processing results, a displacement amount from a reference height position of the mounting surface 10 at each position is calculated. COPYRIGHT: (C)2010,JPO&INPIT