COAXIAL TYPE VACUUM ARC DEPOSITION SOURCE AND VACUUM DEPOSITION SYSTEM

PROBLEM TO BE SOLVED: To provide a coaxial type vacuum arc deposition source which can obtain stable initial discharge by bringing a vapor deposition material into tight-contact with an insulating member, and to provide a vacuum deposition system provided therewith. SOLUTION: The coaxial type vacuum...

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Hauptverfasser: AGAWA YOSHIAKI, MIYAWAKI TSUGIKO, MATSUURA MASAMICHI, TANEMURA MASAYUKI, YAMAGUCHI KOICHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a coaxial type vacuum arc deposition source which can obtain stable initial discharge by bringing a vapor deposition material into tight-contact with an insulating member, and to provide a vacuum deposition system provided therewith. SOLUTION: The coaxial type vacuum arc deposition source 5 comprises: cylindrical insulator 14; a vapor deposition material 11 arranged at the inner circumferential part of the insulator 14 and whose outer circumferential part is brought into elastic-contact with the inner circumferential part of the insulator 14; a trigger electrode 13 arranged at the outer circumferential part of the insulator 14; and a cylindrical anode electrode 23 concentrically arranged around the trigger electrode 13. In this way, the adhesion between the vapor deposition material 11 and the insulator 14 can be always maintained, thus the stable discharge operation of the vapor deposition source 5 can be secured. COPYRIGHT: (C)2010,JPO&INPIT