POLISHING PAD MANUFACTURING METHOD AND POLISHING PAD

PROBLEM TO BE SOLVED: To provide a pad which is useful in in-situ detection of an end point by using an optical method, and also useful in polishing a wafer on which an integrated circuit is mounted. SOLUTION: The pad is useful in polishing the wafer on which the integrated circuit is mounted, and h...

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Bibliographische Detailangaben
1. Verfasser:	ROBERTS JOHN V H
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a pad which is useful in in-situ detection of an end point by using an optical method, and also useful in polishing a wafer on which an integrated circuit is mounted. SOLUTION: The pad is useful in polishing the wafer on which the integrated circuit is mounted, and has a first portion and a second portion. The first portion is made of a hard homogeneous resin sheet which has not intrinsic ability of absorption and transportation of slurry particles and allows light beams having a wavelength in the range of 190 to 3,500 nm to pass therethrough. The second portion is made of an air-injected synthetic urethane structure. COPYRIGHT: (C)2010,JPO&INPIT