COPPER-PLATED VIA OF HIGH ASPECT RATIO, AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide an improved process for manufacturing a via applicable to a requirement in the latest scaling technique, and capable of manufacturing the appropriately operable via in a batch. SOLUTION: The via and its manufacturing technique are provided with the improved high aspe...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MCFEELY FENTON R, YANG CHIHAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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