METHOD OF MANUFACTURING CERAMIC MULTI-LAYERED SUBSTRATES

PROBLEM TO BE SOLVED: To provide a method of manufacturing ceramic substrates in which baking is performed after a conductor layer is formed on a baked ceramic green sheet laminate, wherein a ceramic substrate is prevented from warping, and the surface of the conductor layer is prevented from roughe...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	SHIGEMI ATSUSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing ceramic substrates in which baking is performed after a conductor layer is formed on a baked ceramic green sheet laminate, wherein a ceramic substrate is prevented from warping, and the surface of the conductor layer is prevented from roughening by a baking jig. SOLUTION: In a method of manufacturing a ceramic substrate in which baking is performed after a conductor layer is formed on a baked ceramic green sheet laminate, the baking is performed by using a baking jig having a periphery support region for supporting all the edges of the ceramic green sheet laminate. COPYRIGHT: (C)2010,JPO&INPIT