DEVICE FOR MANUFACTURING LIQUID CRYSTAL DEVICE

PROBLEM TO BE SOLVED: To provide a manufacturing device, capable of efficiently manufacturing a satisfactory liquid crystal device. SOLUTION: The device for manufacturing a liquid crystal device including a liquid crystal layer held between a pair of opposed substrates and an inorganic alignment fil...

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Bibliographische Detailangaben
1. Verfasser:	ASUKE SHINTARO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DIFFUSION TREATMENT OF METALLIC MATERIAL FREQUENCY-CHANGING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a manufacturing device, capable of efficiently manufacturing a satisfactory liquid crystal device. SOLUTION: The device for manufacturing a liquid crystal device including a liquid crystal layer held between a pair of opposed substrates and an inorganic alignment film formed between at least one substrate and liquid crystal or the like comprises a film formation chamber; and a sputtering device for forming the inorganic alignment film by depositing an alignment film material on one substrate within the film formation chamber by sputtering. The sputtering device comprises a storage chamber 31 for storing a target, the chamber having an opening connecting with the film formation chamber; and an electron capturing device 36a for capturing electrons contained in the storage chamber 31. The electron capturing device 36a includes a conductive member 362 partially exposed into the storage chamber 31 and a displacement device 360a for changing the exposure part exposed to the storage chamber 31 of the conductive member 362a by displacing the conductive member 362a. COPYRIGHT: (C)2010,JPO&INPIT