PHOTOSENSITIVE RESIN COMPOSITION, ADHESIVE FILM AND LIGHT RECEIVING DEVICE

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent shape retainability and excellent developability, and to provide an adhesive film and a light receiving device using the composition. SOLUTION: The photosensitive resin composition contains an alkali-soluble resin,...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TAKAHASHI TOYOSEI, SHIRAISHI FUMIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent shape retainability and excellent developability, and to provide an adhesive film and a light receiving device using the composition. SOLUTION: The photosensitive resin composition contains an alkali-soluble resin, a first photopolymerizable compound having a hydrophilic group, a second photopolymerizable compound different from the first photopolymerizable compound, and a thermosetting resin. The adhesive film includes the above photosensitive resin composition. The light receiving device includes a semiconductor element mounting substrate, a transparent substrate disposed at a position opposite to the semiconductor element mounting substrate, and a spacer for regulating a gap formed between the semiconductor element mounting substrate and the transparent substrate, wherein the spacer is obtained by curing the above photosensitive resin composition. COPYRIGHT: (C)2010,JPO&INPIT