SEMICONDUCTOR INTEGRATED CIRCUIT

PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit, capable of reducing resistance and inductance of a part connecting an internal circuit to the outside, and suppressing increase of an area of an I/O region. SOLUTION: This semiconductor integrated circuit is provided with: an I/O c...

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Bibliographische Detailangaben
1. Verfasser: NARUSE TATSUYA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit, capable of reducing resistance and inductance of a part connecting an internal circuit to the outside, and suppressing increase of an area of an I/O region. SOLUTION: This semiconductor integrated circuit is provided with: an I/O cell 161; a PAD 162 and a PAD 142 connected to the I/O cell 161; a package wire 166 connected to the PAD 162 and connectable to the outside of the semiconductor integrated circuit; and a package wire 146 connected to the PAD 142 and connectable to the outside of the semiconductor integrated circuit. A connection 163 point located in between the PAD 162 and the package wire 166 is present in a region for arranging the I/O cell 161 therein, and a connection point 143 between the PAD 142 and the package wire 146 is present in a region outside the I/O cell 161. COPYRIGHT: (C)2010,JPO&INPIT