SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a substrate improving yield and reliability of a semiconductor device, a method for manufacturing the substrate, a semiconductor device, and a method for manufacturing the semiconductor device. SOLUTION: A substrate 60 for fixing an IC element 23 includes: a plurality of posts 37; and plated layers 43a respectively formed on top faces of the posts 37. These plated layers 43a are formed in center parts of the top faces of the posts 37 by a plane view, but are not formed in periphery portions thereof. According to such a configuration, since any "eaves" consisting of the plated layers 43a do not exit, stiffness of the whole plated layers 43a can be raised, and ends of the plated layers 43a can be prevented from falling and peeling. COPYRIGHT: (C)2010,JPO&INPIT