METHOD FOR PRODUCING MOLDED INTERCONNECT DEVICE

PROBLEM TO BE SOLVED: To form a precise three-dimensional conductive circuit which exhibits excellent adhesion properties without roughening the surface of a substrate, and saves on the resource of precious noble metals contained in a catalyst. SOLUTION: An OH group 1a is formed on the surface of a first substrate 1, and then the first substrate is coated with a functional molecular adhesive 2 consisting of a thiol-reactive alkoxysilane compound and then heated and dried. After the non-reacted functional molecular adhesive 2 is removed by alcoholic cleaning, a coating material 3 consisting of polyglycolic acid is applied partially to form a second substrate 4. After a catalyst 5 is imparted to the surface of the second substrate 4, the catalyst remaining on the surface of the coating material 3 is washed with water and removed. The part not coated with the coating material 3 is then subjected to electroless plating A of acid or neutral bath composition, and the coating material 3 is removed by an alkaline aqueous solution. The functional molecular adhesive 2 is chemically bonded to the OH group on the surface of the first substrate 1 to form a thiol group, and the thiol group is chemically bonded to the electroless plating A firmly through the catalyst 5. COPYRIGHT: (C)2010,JPO&INPIT