SUBSTRATE LAMINATING METHOD

SUBSTRATE LAMINATING METHOD

PROBLEM TO BE SOLVED: To provide a substrate laminating method for laminating substrates to each other with good quality. SOLUTION: (a) A first sealant is applied to one surface of a first substrate and one surface of a second substrate up to a first height, and a second sealant is applied to them u...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIRITA HIDEKAZU, KISAKA HIROSHI
Format: Patent
Sprache:eng
Schlagworte:
ADVERTISING
CRYPTOGRAPHY
DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING
DISPLAY
DISPLAYING
EDUCATION
FREQUENCY-CHANGING
LABELS OR NAME-PLATES
NON-LINEAR OPTICS
OPTICAL ANALOGUE/DIGITAL CONVERTERS
OPTICAL LOGIC ELEMENTS
OPTICS
PHYSICS
SEALS
SIGNS
TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a substrate laminating method for laminating substrates to each other with good quality. SOLUTION: (a) A first sealant is applied to one surface of a first substrate and one surface of a second substrate up to a first height, and a second sealant is applied to them up to a second height higher than the first height so as to surround portions to which the first sealant is applied. (b) the first substrate is held on the lower side and the second substrate is held on the upper side by electrostatic adsorption, whereby the first and second substrates are disposed so that the surfaces to which the first and second sealants have been applied so as to face the other surfaces to which the first and second sealants have been not applied. (c) the first and second substrates are brought closer to each other so that a clearance between the first and second substrates is lower than the second height. (d) The electrostatic adsorption of the second substrate is released to press-fix the first and second substrates to each other. COPYRIGHT: (C)2010,JPO&INPIT