METAL-CLAD POLYIMIDE SUBSTRATE AND ITS PRODUCTION METHOD

PROBLEM TO BE SOLVED: To provide a metal-clad polyimide substrate which is very low in pinhole numbers occurring on the exterior surface of a copper layer to be formed and is high in folding durability when used in a bent portion, due to excellent pinhole characteristics and MIT folding durability o...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	OGASAWARA SHUICHI, SONE HIROBUMI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a metal-clad polyimide substrate which is very low in pinhole numbers occurring on the exterior surface of a copper layer to be formed and is high in folding durability when used in a bent portion, due to excellent pinhole characteristics and MIT folding durability of the exterior surface. SOLUTION: The metal-clad polyimide substrate is characterized in that: it has a folding durability of 250-3,000 folds as set up in MIT folding durability test and excellent pinhole characteristics of the exterior surface, and that it has a laminated structure comprising a polyimide film of 3-13 μm thickness, a seed layer consisting of at least one metal selected from nickel, chrome or copper formed on the polyimide film and the copper layer formed further on the seed layer. COPYRIGHT: (C)2010,JPO&INPIT