SEMICONDUCTOR ASSEMBLY WITH SPECIALLY FORMED BOND WIRES, AND METHOD FOR FABRICATING SUCH ARRANGEMENT

PROBLEM TO BE SOLVED: To provide a semiconductor device, having a bond conductor which is more appropriate than conventional bond conductors as to cost. SOLUTION: The semiconductor device relates to a device in which at least two integrated circuits IC1, IC2 are arranged within a housing and electrically connected to each other via a bond conductor 10, and to a method for manufacturing such a semiconductor device. At least one of the bond conductors 10 has a first, preferably, a spherical end part 12 which is to be connected to a contact pad 3 of the first integrated circuit IC1. Preferably, another end part 14 of the bond conductor 10 formed into the shape of a wedge is similarly made to be brought into contact with a contact pad 6 of the second integrated circuit IC2 via a spherical intermediate element 20. The intermediate element 20 is formed by a material softer than the bond conductor 10. Preferably, the bond conductor 10 is formed with copper or an alloy of copper, and the intermediate element 20 is formed with gold or an alloy of gold. COPYRIGHT: (C)2010,JPO&INPIT