AQUEOUS ADHESIVE COMPOSITION

PROBLEM TO BE SOLVED: To provide an aqueous adhesive composition excellent in storage stability of its main agent, and equipping bonding performance excellent in waterproofness and heat resistance. SOLUTION: The aqueous adhesive composition contains: a main agent containing a water soluble polymer c...

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Bibliographische Detailangaben
Hauptverfasser: HARASHIMA SUSUMU, MORINAGA HIROYASU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an aqueous adhesive composition excellent in storage stability of its main agent, and equipping bonding performance excellent in waterproofness and heat resistance. SOLUTION: The aqueous adhesive composition contains: a main agent containing a water soluble polymer containing a cationic group, at least one aqueous polymer without containing the cationic group; a curing agent containing an epoxy compound containing ≥2 epoxy groups in its molecule; and a polyamide epoxy compound. The water soluble polymer containing the cationic group is the water soluble polymer containing a primary amine, a secondary amine, a tertiary amine and their salts in its molecule or an aqueous solution of the water soluble polymer. The aqueous polymer without containing the cationic group is selected from the group consisting of the water soluble polymer without containing the cationic group, the aqueous solution of the water soluble polymer, an aqueous latex without containing the cationic group and an aqueous emulsion without containing the cationic group. The polyamide epoxy compound is the compound obtained by reacting epihalohydrin with a polyamine or polyamide. COPYRIGHT: (C)2010,JPO&INPIT