SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a semiconductor device, having an air vent, which prevents a covering member from decreasing in mechanical strength and changing in shape, and suppress flowing of a bonding member into an unnecessary portion, and is provided with the air vent of suitable size precise...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a semiconductor device, having an air vent, which prevents a covering member from decreasing in mechanical strength and changing in shape, and suppress flowing of a bonding member into an unnecessary portion, and is provided with the air vent of suitable size precisely with good mass-productivity. SOLUTION: The semiconductor device includes a support substrate 101 on which a semiconductor element 105 is mounted, a covering member 102 disposed to the support substrate 101 via the bonding member, and a space 107 defined between the covering member 102 and the support substrate 101. The support substrate 101 has a protruded portion 103 and the covering member 102 is disposed so that a portion thereof is in contact with the protruded portion 103 so as to define the air vent leading from the space 107 to outside. COPYRIGHT: (C)2010,JPO&INPIT |
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