METAL-CLAD LAMINATE AND WIRING INTEGRATION TYPE SUSPENSION

PROBLEM TO BE SOLVED: To provide a metal-clad laminate having a sufficient strength for forming a stable flying lead and meeting the demand of microfabricated circuit by using an electrolytic copper foil. SOLUTION: In the metal-clad laminate, a copper foil layer formed of the electrolytic copper foil, a polyimide resin layer, and a stainless steel foil layer are laminated in this order. The average particle size value in the crystal grains of the copper constituting the copper foil layer falls in a range of 0.5 μm to 3.0 μm. Columnar grains exist in the crystal grains. The short diameters of the columnar grains are 2.0 μm or smaller, and the ratio of the long diameter to the short diameter falls in a range of 2 or more and 9 or less. The angle defined by the long diameter direction in the columnar grains and the surface direction of the copper foil layer is 70° or more and 90° or less (or 90° or more and 110° or less). COPYRIGHT: (C)2010,JPO&INPIT