POLYIMIDE METAL LAMINATED BODY, WIRING SUBSTRATE, MULTILAYER METAL LAMINATED BODY, AND MULTILAYER WIRING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a polyimide metal laminated body improved, compared with conventional, in adhesion property, after aging treatment under normal state and high temperature, of (between) an aromatic polyimide film surface and a metal conductive layer, and also good in electric insulat...

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Bibliographische Detailangaben
Hauptverfasser: YOKOZAWA YOSHIHIRO, KUNO SHINJI, KODA MASAFUMI, BANBA KEITA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a polyimide metal laminated body improved, compared with conventional, in adhesion property, after aging treatment under normal state and high temperature, of (between) an aromatic polyimide film surface and a metal conductive layer, and also good in electric insulation reliability, even in aromatic polyimide, hard to be chemically sufficiently modified in surface, which is obtained from an aromatic tetracaboxylic component, consisting mainly of 3, 3', 4, 4'-biphenyltetracaboxylic acid dianhydride, and an aromatic diamine component. SOLUTION: The polyimide metal laminated body includes a metal layer which is formed, by a wet type plating process, on the modified surface of the polyimide film the one side or both sides of which are modified by a component selected from aluminum oxide, a titanium oxide and a silicon oxide, wherein the wet type plating process consists of the step of treating the modified surface of the polyimide film with an alkali solution, the step of treating it with a basic amino acid solution, the step of supplying a catalyst, and the step of forming the metal layer by electroless metal plating. COPYRIGHT: (C)2010,JPO&INPIT