METHOD OF ENCAPSULATING OPTOELECTRONIC ELEMENT

PROBLEM TO BE SOLVED: To provide a method of encapsulating optoelectronic elements. SOLUTION: In this method of encapsulating optoelectronic elements, by embedding the elements to be encapsulated between a first transparent polymer layer and a second polymer layer, which is filled with unactivated f...

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Bibliographische Detailangaben
Hauptverfasser:	ZMARSLY FRANZISKA, BURMEISTER AXEL
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of encapsulating optoelectronic elements. SOLUTION: In this method of encapsulating optoelectronic elements, by embedding the elements to be encapsulated between a first transparent polymer layer and a second polymer layer, which is filled with unactivated foaming agent, and then activating the foaming agent, so that both the polymer layers are joined to each other, in particular, welded to each other, and the elements are enclosed between both the polymer layers. COPYRIGHT: (C)2010,JPO&INPIT