EXPOSURE DEVICE AND SEMICONDUCTOR MANUFACTURING SYSTEM

PROBLEM TO BE SOLVED: To improve a manufacturing yield. SOLUTION: A semiconductor manufacturing system includes: an operation unit 103 which calculates correction doses for a plurality of coordinates for adjusting the dimensions of a resist pattern formed on a wafer by exposure by a predetermined dose at the plurality of coordinates into predetermined target dimensions, calculates a first approximate function approximating the distribution of the correction dose in the wafer surface, calculates a second approximate function approximating the first approximate function after a trimming processing, the trimming processing being carried out so as to settle the first approximate function between a predetermined upper limit dose and lower limit dose, and outputs recipe parameters including factors of the second approximate function; and an exposure device 105 carrying out exposure processing depending on the recipe parameter. COPYRIGHT: (C)2010,JPO&INPIT